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If used within the specified operating ratings, chips of photodiodes will exhibit virtually no deterioration of characteristics. Deterioration can often be attributed to package, lead or filter failure. Package leakage at high temperatures and humidity, in particular, often causes the dark current to increase. Therefore, plastic and ceramic package photodiodes have a somewhat limited temperature and humidity range. In contrast, metal package types feature excellent resistance to ambient humidity. Photodiodes with filters are greatly affected by endurance of the filter to environmental conditions.
These factors must be taken into consideration when using and storing photodiodes.Hamamatsu photodiodes are subjected to reliable test based on JEITA (Japan Electronic Information and Tech-nology Association). Reliable tests are also performed in compliance with MIL (US Military) standards and IEC (In-ternational Electrotechnical Commission) standards ac-cording to the product applications. The major reliability test standards used by Hamamatsu are summarized be-low in major reliability test standards.
Major reliability test standards
|
Test item |
Condition |
ED-4701 |
Criteria |
|
Terminal
strength |
Pulling 10
seconds, bending 90° two times |
A-111 |
Damage to
terminal, etc. |
|
Vibration |
100 to 2000 Hz,
200 m/s2 XYZ directions,
4 minutes,
4 times each
(total 48 minutes) |
A-121 |
Appearance and
electrical characteristics |
|
Shock |
1000 m/s 2, 6 ms XYZ directions, 3 times each |
A-122 |
|
Solderability |
235 ± 5 °C, 5 or
2 seconds, 1 to 1.5 mm |
A-131 |
Solderability |
|
Resistance to soldering heat (except surface mount
type) |
260 ± 5 °C, 10
seconds, 1 to 1.5 mm |
A-132 |
Appearance and
electrical characteristics |
|
Resistance to soldering heat (surface mount type) |
Reflow 235 °C,
10 seconds |
A-133 |
|
High temperature
storage |
Tstg (Max.) :
1000 hours |
B-111 |
|
Low temperature
storage |
Tstg (Min.) :
1000 hours |
B-112 |
|
High
temperature, high humidity storage |
60 °C, 90 %:
1000 hours |
B-121 |
|
Temperature
cycle |
Tstg Min. to
Tstg Max., in air,
30 minutes each, 10 cycles |
B-131 |
|
Electrostatic
discharge |
R=1.5 kΩ,
C=100 pF, E=±1000 V, 3 times |
C-111 |
|
Resistance to
solvent |
Isopropyl
alchohol, 23 ± 5 °C, 5 minutes |
C-121 |
Marking
legibility, paint peeling |
|
High temperature
reverse bias |
Topr Max., VRMax.: 1000 hours |
D-212 |
Appearance and
electrical characteristics |
Note 1) Reference standardsTest method: JEITA-ED-4701 “Environmental and endurance test methods for semiconductor devices”
Note 2) Breakdown criteria standardsTest conditions and breakdown criteria standards table for collecting reliability test data(National Institute of Advanced Industrial Science and Technology)
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