Hamamatsu provides photoemission (EMMI) and thermal emission microscopes, as well as thermal (OBIRCH) and photoelectrical (OBIC) laser stimulation systems for the failure analysis field and the design debug markets.
Our tools are suited for a wide variety of architecture: from the die or wafer level, to package or applications board level, up to probe card level and direct docking with tester environment. Using our tools, our customers observe parametric defects in static conditions and/or functional failures in dynamic conditions.
For over 20 years, our failure analysis tools are known worldwide as high-quality products. We combine our state-of-the-art confocal optical design for various wavelength bandwidths with our own core detection technologies such as InGaAs or thermal sensors. In addition, we integrate highly accurate and stable mechanical stages down to the microprobing level.
