The iPhemos-TP is designed for 200mm or 300mm wafer probing. It provides high resolution 640x512 20?m InGaAs photoemission, static and dynamic laser techniques and/or InSb true thermal emission capability utilizing a 5-positiion turret or Hamamatsu’s exclusive 10-position turret.

The iPhemos-SD is designed for direct tester docking. It is available with either photoemission or thermal capability as well as optional laser techniques. Its compact mechanical package allows for portability and use amongst multiple testers.

The iPhemos-TD is designed for direct tester docking with multiple platforms.  A maximum of 3 cameras and 2 lasers can be installed.  The system structure has a loser applcation option alloowing a ariety of backside analyss while using many types of detectors

Integrating Hamamatsu's years of inverted tool and hard testing docking experience with our most advanced optical FA techniques, the iPhemos series meets the needs of today and tomorrows most advanced process devices.

Hamamatsu's Bob Roche discusses the iPhemos Failure Detection System. (requires Flash 6 player, 6.5 MG, 2:30" running time.)

• Direct tester docking or 200/300mm prober capablity
• Technique optimized 10-lens turret
• Hamamatsu designed quartz and germanium lenses
• Custom 640x512 20?m InGaAs photoemission array
• True thermal 3-5?m range InSb detector
• Static and dynamic laser technique support
• Portable version, iPhemos-SD
• Optional device cooling/heating
• Optional Nanolens capability

• Tester based Failure Analysis
• 200/300mm wafer backside probing
• Failure Analysis
• Fault Isolation
• Yield Enhancement
• Functional failure localization
• Photoemission and thermal localization