The THEMOS-1000 true thermal emission microscope system with integrated NIR LSM confocal laser provides faster, more accurate localization through improved pattern resolution and true thermal sensitivity.

Improved true thermal sensitivity is achieved through the use of an InSb detector with spectral response covering the true thermal black body radiation range of 3-5?m and through the use of Hamamatsu designed germanium macro and micro lenses.

Greater pattern resolution is achieved by integrating a 1310nm IR Confocal LSM laser with resolution of better than 0.5?m. Overlaying the LSM pattern image with perfect registration to the thermal signal improves localization resolution by greater than 6X. Optional OBIRCH capability extends the performance of this tool for all similar failure modes.

Incorporating the same optical, mechanical and software concepts as our Phemos series for die, packages and wafer applications the Themos-1000 is the most appropriate failure analysis tool for devices requiring true thermal detection and localization.

• Die, packaged device or wafer probing
• Tester cable docking
• Independent true thermal 0.8X macro lens
• Hamamatsu custom true thermal objectives
• Hamamatsu custom laser lenses
• Long working distances
• Frontside and backside capability
• True thermal 3-5µm response
• Highly accurate laser to thermal image registration
• Optional OBIRCH capability
• Optional InGaAs photoemission capabilty

• Microplasma leaks in oxide layer
• Oxide layer breakdown
• Short-circuit of metalization
• Contact holes
• Non-OBIRCH applicable devices

• Phemos
• uAmos
• Optical MicroGauge, (C8870)
• IC Polisher (C9107)
• FA NAV Software