| Part Number |
C8870 |
| Name of product |
Optical MicroGauge, wafer thickness measurement system |
| Brief description |
Non-contact measurement of wafer or device substrate thickness |
|
Full description |
|
Hamamatsu's MicroGauge series of laser based non-contact wafer thickness systems allows accurate measurement for wafers as thin as 10µm. The MicroGauge's optical measurement method can distinguish wafer thickness from tape and does not risk physical damage to the wafer. Our C8870 units are packaged with stage, lighting and controllers for off-line measurements. |
|
Features |
- Non-contact measurement
- IR laser for backside measurement
- Measures through ring tape
- 1µm accuracy / 0.1µm repeatability
- Rated for 10µm-700µm wafers
- 300mm wafer support
- Available as in-line sensor or integrated off-line system
- Semi compliant
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|
Applications |
- Grinder Process Control
- Etcher Process Control
- Yield Enhancement
- Metrology
- Emission sample preparation
|
| Related Products |
C8125-01 |
| Standards Compliance |
CE,
IEC 60825-1 (laser class 1) |
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